Quantum Processor Design Package — Ready-to-Tape-Out
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You will review licensing terms and NDA before payment.
| Component | Description |
|---|---|
| RTL Bundle | 10 core Verilog modules (voxel_cell, quantum_exec_unit, QEC, photonic IO, power recycler, light trigger, EM cooling, quantum battery, color math ALU, neuromorphic engine) + 5 integration modules for hybrid CPU top-level. |
| Per-SKU Overlays | Synthesis constraints (SDC), floorplan (TCL), place-and-route config for your selected die generation. |
| Build Scripts | End-to-end GDSII generation (WSL/Linux/macOS). Yosys synthesis → OpenLane2 P&R → final masks. |
| Foundry Handoff | 44-line canonical form (SKU, process, CD target, packaging window). Ship to Intel IFS, TSMC, or your foundry. |
| Documentation | APM-D-QPHY architectural spec, foundry standards, per-SKU STORE_LISTING.md. |
| Support | 24/7 email support. Design iteration via CRI-ONE AutoPhi Seed Matrix ($50/iteration). |
See Photons per Dollar: The Thermodynamic Ceiling of Quantum Hardware for our full pricing justification (Landauer limits, market benchmarks, and why QBeam costs 6–3200× less than competing quantum processors).
This product is delivered under the CRI-ONE Mutual NDA + Engagement Terms (v1) at cri-one.com/mutual-nda-v1.php. US companies only. APM04 and above (5 nm and finer) carry specific EAR/BIS export classifications. Do not re-export. Questions? Reply to your receipt email or email crioneaka@outlook.com.